Used semiconductor & Scientific equipment, ISO14001 certified

Japanese

Tanaka Corporation

WEST BOND／Pin Set Manual Die Bonder／MODEL7367A Ref.No.03082
  • Eutectic Pin Set Die Bonder
  • Bonding Style : Eutectic bonding style (heat+load+scrub)
  • Load : Changeable from 5 to 150g
  • Chip Pickup Style : Air pin set style
  • Scrub Cycle : 0-9 scales, 10 stages changeable
  • Scrub Rate : 0-9 scales, 10 stages changeable
  • Scrub Stroke : 0-9 scales, 10 stages changeable
  • Scrub Way : X way
  • Accessories : Stereo microscope, Jig for proofreading(including weight), Small pump

*Work holder and Temperature controller is not attached.

BOND／Pin Set Manual Die Bonder／MODEL7367A Ref.No.  BOND／Pin Set Manual Die Bonder／MODEL7367A Ref.No.   BOND／Pin Set Manual Die Bonder／MODEL7367A Ref.No.  
BOND／Pin Set Manual Die Bonder／MODEL7367A Ref.No.   BOND／Pin Set Manual Die Bonder／MODEL7367A Ref.No.   BOND／Pin Set Manual Die Bonder／MODEL7367A Ref.No.