Used semiconductor & Scientific equipment, ISO14001 certified

Japanese

Tanaka Corporation

ENGIS／Rough Lapping Machine／EJW-400IN Ref.No.02915
  • Lap Plate Diameter Max.(Outside Diameter x Inside Diameter) : φ380mm x φ140mm

*Lap plate attached now is φ300 x φ100mm.

  • Motor : 1.5kW, 200V, 3 phases
  • Revolution(rpm) : 0-343rpm
  • Facing Function : No
  • Dimension : W700 x D1600 x H1400mm
  • Weight : About 900kg
  • Others : Outside control unit is attached.

ENGIS／Rough Lapping Machine／EJW-400IN Ref.No.02915   ENGIS／Rough Lapping Machine／EJW-400IN Ref.No.02915   ENGIS／Rough Lapping Machine／EJW-400IN Ref.No.02915