Used semiconductor & Scientific equipment, ISO14001 certified

Japanese

Tanaka Corporation

Buehler／Precision Parallel Griding System／MPC3000 Ref.No.03074

It is possible to do IC chip backside griding, wafer frontside film grinding, and multilayer pattern griding.

  • Griding Plate Revolution : 10-490 RPM
  • Sample Mouting Unit : Heat / cool unit(110 deg max.), Built-in vacuum pump 
  • Griding Fixture : 1μm reader digital micrometer, Oscillating system connection
  • Power Supply : AC100V  50/60Hz  750W 
  • Griding Unit Dimension / Weight : W572 x D715 x H572(mm) / 91kg
  • Sample Mounting Unit Dimension / Weight : W305 x D475 x H278(mm) / 15kg

Buehler／Plane Griding System／MPC TM 3000 Ref.No.03074   Buehler／Plane Griding System／MPC TM 3000 Ref.No.03074    Buehler／Plane Griding System／MPC TM 3000 Ref.No.03074   
Buehler／Plane Griding System／MPC TM 3000 Ref.No.03074   Buehler／Plane Griding System／MPC TM 3000 Ref.No.03074   Buehler／Plane Griding System／MPC TM 3000 Ref.No.03074